• DocumentCode
    3286062
  • Title

    High performance flip-chip technique for wide-band modules

  • Author

    Iwasaki, Naoki ; Ishitsuka, F. ; Kato, Toshihiko

  • Author_Institution
    NTT Interdisciplinary Res. Labs., Tokyo
  • fYear
    1996
  • fDate
    28-30 Oct 1996
  • Firstpage
    207
  • Lastpage
    209
  • Abstract
    A novel wide-band flip-chip technique is proposed, where optimized wide-gap coplanar waveguides are used to reduce the discontinuity. The flip-chip technique made it possible to achieve the return loss of over 28 dB up to 80 GHz
  • Keywords
    MIMIC; MMIC; coplanar waveguides; flip-chip devices; hybrid integrated circuits; integrated circuit packaging; microassembling; modules; 28 dB; 60 GHz; EHF; SHF; high performance flip-chip technique; micro-bumps; return loss; wide-band modules; wide-gap CPW; wide-gap coplanar waveguides; wideband flip-chip technique;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
  • Conference_Location
    Napa, CA
  • Print_ISBN
    0-7803-3514-7
  • Type

    conf

  • DOI
    10.1109/EPEP.1996.564832
  • Filename
    564832
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3286062