Title :
System level EM modeling of digital IC packages and PC boards
Author :
Jong-Gwan Yook ; Arabi, T. ; Katehi, L.P. ; Sakallah, Karem A.
Author_Institution :
Radiation Lab., Michigan Univ., Ann Arbor, MI
Abstract :
For an accurate system level electromagnetic (EM) modeling of digital IC packages and PC boards, a new methodology is developed combining electromagnetic and circuit simulators. The EM modeling of geometrical details in the IC´s structures based on a full-wave finite element method provides accurate equivalent circuits which are incorporated in a system level circuit simulator. This circuit simulator results in HSPICE type of RLC circuits which are then analyzed in time domain to compute switching noise at any designate places
Keywords :
SPICE; circuit analysis computing; circuit noise; digital circuits; digital integrated circuits; electromagnetic field theory; equivalent circuits; finite element analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; printed circuits; time-domain analysis; EM field analysis; HSPICE type RLC circuits; circuit simulator; digital IC packages; digital PC boards; digital PCBs; electromagnetic modeling; electromagnetic simulator; equivalent circuits; finite element method; full-wave FEM; geometrical details; switching noise; system level EM modeling; time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564844
