DocumentCode :
3287095
Title :
A new electrothermal technology based on LIEP method
Author :
Qi, Weimin ; Ji, Xiaowei
Author_Institution :
Sch. of Phys. & Inf. Eng., Jianghan Univ., Wuhan, China
fYear :
2011
fDate :
15-17 April 2011
Firstpage :
1051
Lastpage :
1054
Abstract :
Laser Induced Electroless Plating(LIEP) has many advantages such as relatively low cost, homogeneous microstructure, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and thus became a hot research topic in flexible circuit making. But the wide application of LIEP has still some defects, such as poor accuracy, low speed and low repeatability brought by the concentration, temperature, thickness of plating solution. An improved algorithm is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A mathematical model is also established and the simulation has been done. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future micro electro mechanical systems and its microfabrication.
Keywords :
micromechanical devices; substrates; AC electrothermal technology; flexible circuit making; laser induced electroless plating; micro electro mechanical systems; microfabrication; nonmetal substrates; Electric fields; Electrodes; Equations; Fluids; Mathematical model; Substrates; Laser Induced Electroless Plating(LIEP); electrothermal technology; flexible circuit; microfabrication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electric Information and Control Engineering (ICEICE), 2011 International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-8036-4
Type :
conf
DOI :
10.1109/ICEICE.2011.5777962
Filename :
5777962
Link To Document :
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