DocumentCode :
3287122
Title :
The Technology Integration Outreach Project: Developing "best practices" curriculum units
Author :
Engstrom, Mary ; Yost, Rosanne ; Thompson, Ray ; Versteeg, Don
Author_Institution :
Sch. of Educ., South Dakota Univ., Vermillion, SD, USA
fYear :
2002
fDate :
3-6 Dec. 2002
Firstpage :
1303
Abstract :
The Technology Integration Outreach Project (TIOP) is a joint project between the Southeast Interactive Long Distance Learning Consortium (SILDL), and University of South Dakota School of Education´s Professional Development Center (PDC) and it´s Learning Organizations for Technology Integration Project (LOFTI). Three outcomes guide the projects work: (1) develop partnerships with USD School of Education and K-12 schools; (2) create curriculum models of best practices in technology integration. (3) utilize distance technologies as a communication tool for professional development across the project. Three separate TIOP Projects have taken place. During the Spring Semester of 2001, the fall of 2001 and the spring of 2002 TIOP interdisciplinary teams were assembled and completed the development of best practices curriculum units with technology integration as a key element of the unit. About four-dozen teachers, faculty and pre-service teachers have participated in completing eight units. Experiences will be shared with text and video.
Keywords :
computer aided instruction; educational courses; project engineering; teaching; training; K-12 schools; Learning Organizations for Technology Integration Project; Southeast Interactive Long Distance Learning Consortium; Technology Integration Outreach Project; USA; best practices; curriculum models; distance technologies; professional development; Assembly; Best practices; Collaborative work; Communications technology; Computer aided instruction; Computer science education; Educational institutions; Educational technology; Springs; Video sharing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computers in Education, 2002. Proceedings. International Conference on
Print_ISBN :
0-7695-1509-6
Type :
conf
DOI :
10.1109/CIE.2002.1186219
Filename :
1186219
Link To Document :
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