Title :
Framework for co-simulation of signal and power integrity in server systems
Author :
Winkel, T. ; Harrer, Hubert ; Strach, Thomas ; Rimolo-Donadio, Renato ; Kwark, Y. ; Xiaomin Duan ; Schuster, Christian
Author_Institution :
R&D, IBM Germany, Boeblingen, Germany
Abstract :
Considerations for comprehensive simulation and analysis of high-speed links in complex server systems are discussed in this work. A framework that considers the interactions between multiple signals and the power distribution network is described. In the last section, the nature of the interactions between power and signal domains is analyzed by means of a simplified scenario at board level.
Keywords :
circuit simulation; high-speed integrated circuits; integrated circuit interconnections; complex server system; high-speed link; interconnects; multiple signals; power distribution network; power domain; power integrity; signal cosimulation; signal domain; signal integrity; Couplings; Integrated circuit modeling; Noise; Numerical models; Packaging; Scattering parameters; high-speed links; interconnects; power integrity; server systems; signal integrity;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457834
