• DocumentCode
    3287467
  • Title

    Fast assessment of the impact of surrounding wiring on the transmission properties of high-speed interconnect channels

  • Author

    Joon Hyung Chung ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2012
  • fDate
    21-24 Oct. 2012
  • Firstpage
    69
  • Lastpage
    72
  • Abstract
    A methodology is proposed for the fast assessment of the impact of electromagnetic loading by surrounding wiring on the signal transmission properties of a high-speed interconnect channel. The proposed methodology is aimed at alleviating the computational complexity of the electromagnetic modeling of the channel including the details of the wiring in its surrounding that, more often than not and especially in the early stages of design, are not well defined and thus are best accounted for through a Monte Carlo analysis. Instead, use of a stochastic macromodel for the channel is proposed that incorporates the electromagnetic attributes of the surrounding wiring through a statistical description of its loading on the interconnects of the channel. The proposed method makes use of parametric rational interpolation to develop a frequency-dependent macromodel that is valid over the multi-dimensional space that describes the uncertainty of the neighboring layout topography. Making use of stochastic collocation, the channel macromodel lends itself to fast quantitative analysis of the channel transmission properties and signal degradation in both frequency and time domain. A simple channel example, which allows us to assess the accuracy of the proposed method, is used to demonstrate the key attributes of the proposed method and comment on its usefulness as a computer-aided tool for noise-aware wiring layout planning.
  • Keywords
    Monte Carlo methods; computational complexity; computational electromagnetics; frequency-domain analysis; interpolation; optical interconnections; stochastic processes; time-domain analysis; Monte Carlo analysis; channel macromodel; channel transmission property; computational complexity; computer-aided tool; electromagnetic attributes; electromagnetic loading; electromagnetic modeling; frequency domain; frequency-dependent macromodel; high-speed interconnect channels; multidimensional space; neighboring layout topography; noise-aware wiring layout planning; parametric rational interpolation; quantitative analysis; signal degradation; signal transmission propert; statistical description; stochastic collocation; stochastic macromodel; surrounding wiring; time domain; Frequency domain analysis; Interpolation; Loading; Stochastic processes; Uncertainty; Wires; Wiring; electromagnetic loading; high-speed channel; layout uncertainty; multiconductor interconnects; rational function interpolation; signal integrity; stochastic modeling; transient simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
  • Conference_Location
    Tempe, AZ
  • Print_ISBN
    978-1-4673-2539-4
  • Electronic_ISBN
    978-1-4673-2537-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2012.6457845
  • Filename
    6457845