Title :
Graphene-based EMI shielding for vertical noise coupling reduction in 3D mixed-signal system
Author :
Kiyeong Kim ; Kyoungchoul Koo ; Seulki Hong ; Jonghoon Kim ; Byungjin Cho ; Joungho Kim
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Abstract :
Vertical noise coupling caused by the near-field coupling between the RF/analog IC and logic IC is a severe problem in 3D mixed-signal systems. To reduce the vertical noise coupling, graphene is an appropriate material due to its inherent characteristics such as very low thickness, high flexibility, high mechanical strength, and EMI absorbing characteristic. Especially, the EMI absorbing characteristic is an important property as the shield to prevent the vertical noise coupling, as it reduces the re-coupling of the reflected EMI by the shield into other ICs. We measure the reduction of the vertical noise coupling by the mono-layer graphene shield in the 3D mixed-signal system composed of a low noise amplifier (LNA), an on-chip switching model DC-DC converter, and the mono-layer graphene in the frequency and time domain. Through the measurement results, we observed that the mono-layer graphene can maximally reduce the vertical noise coupling by -17 dB in the frequency domain. Additionally, the vertically coupled noise is reduced by 25% in the time domain measurement.
Keywords :
DC-DC power convertors; electromagnetic interference; electromagnetic shielding; electromagnetic wave absorption; graphene; low noise amplifiers; time-frequency analysis; 3D mixed-signal system; C; EMI absorbing characteristic; LNA; RF-analog IC; RF-logic IC; frequency domain; graphene-based EMI shielding; low noise amplifier; monolayer graphene shield; near-field coupling; on-chip switching model DC-DC converter; time domain measurement; vertical noise coupling reduction; Couplings; Electromagnetic interference; Frequency measurement; Graphene; Integrated circuits; Noise; Noise measurement; 3D mixed-signal system; Absorbance; Mono-layer graphene; Shielding Effectiveness; Vertical noise coupling;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457862