• DocumentCode
    3288046
  • Title

    Simulation-based design of high dimensional electromagnetic systems

  • Author

    Wei Cui ; Sathanur, Arun V. ; Jandhyala, Vikram

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
  • fYear
    2012
  • fDate
    21-24 Oct. 2012
  • Firstpage
    199
  • Lastpage
    202
  • Abstract
    Full-wave simulation and design of interconnect systems is becoming increasingly important in view of the continuing trend towards miniaturization and dense integration of components in electronic systems. While full-wave simulation methods have advanced rapidly over the last decade, there is a growing need for superior automated design tools. In this paper we first motivate the need for better design space exploration in high dimensions and outline the key ingredients that are imperative for the development of a successful simulation-based automated design tool. In this direction we describe the application of Orthogonal Arrays as an efficient sampling scheme and the Gaussian Process Regression as a promising model generation scheme for high dimensional design space exploration. We also describe an adaptive strategy for the model refinement and illustrate the same with a full-wave multi-conductor transmission line example. Finally we conclude by outlining the open problems and research challenges in this direction.
  • Keywords
    Gaussian processes; interconnections; multiconductor transmission lines; regression analysis; Gaussian process regression; design space exploration; full-wave multiconductor transmission line; full-wave simulation; high dimensional electromagnetic systems; interconnect systems; orthogonal arrays; sampling scheme; Adaptation models; Computational modeling; Covariance matrix; Gaussian processes; Ground penetrating radar; Linear programming; Scattering parameters; EDA; Electromagnetic simulation; Field solver; Full-Wave; Gaussian Process; High Dimensional Optimization; Orthogonal Arrays; Polynomial Interpolation; Regression;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
  • Conference_Location
    Tempe, AZ
  • Print_ISBN
    978-1-4673-2539-4
  • Electronic_ISBN
    978-1-4673-2537-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2012.6457876
  • Filename
    6457876