DocumentCode
3288070
Title
Minimizing displacement return currents in multilayer via structures
Author
Hardock, Andreas ; Muller, Sebastian ; Xiaomin Duan ; Bruns, H. ; Schuster, Christian
Author_Institution
Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
fYear
2012
fDate
21-24 Oct. 2012
Firstpage
208
Lastpage
211
Abstract
A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.
Keywords
printed circuits; contour integral method; displacement return current minimization design; ground via return currents; multilayer via structures; multilayered boards; printed circuit board; Apertures; Cavity resonators; Crosstalk; Electromagnetic compatibility; Impedance; Ports (Computers); Reflection; printed circuit board; return current; via;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location
Tempe, AZ
Print_ISBN
978-1-4673-2539-4
Electronic_ISBN
978-1-4673-2537-0
Type
conf
DOI
10.1109/EPEPS.2012.6457878
Filename
6457878
Link To Document