Title :
Wafer-level TSV connectivity test using ring oscillator scheme
Author :
Jun So Pak ; Jonghyun Cho ; Joohee Kim ; Heegon Kim ; Kiyeong Kim ; Joungho Kim ; Junho Lee ; Kunwoo Park
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
Abstract :
This paper presents the wafer-lvel TSV connectivity test method using ring oscillator scheme by showing its good immunity to TSV and chip process variations, efficient use of a chip area, simplicity of the test circuitry design, and low cost from its application before expensive wafer thinning and stacking processes. The proposed method can detect a delamination failure between TSVs and back end lines on a single TSV processed wafer.
Keywords :
delamination; failure analysis; integrated circuit design; integrated circuit reliability; integrated circuit testing; oscillators; chip process variations; delamination failure; expensive wafer thinning process; ring oscillator scheme; single TSV processed wafer; test circuitry design; through silicon via; wafer stacking process; wafer-level TSV connectivity test method; Arrays; Capacitance; Inverters; Radiation detectors; Ring oscillators; Through-silicon vias; 3DIC; Connectivity; Delamination Problem; Ring Oscillator; TSV; Wafer-level;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457883
