Title :
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585)
Abstract :
The following topics are dealt with: assembly with low-k dielectrics; reliability and lead-free; green manufacturing; stacked die; characterization and modelling; emerging trends in electronics manufacturing; advances in wire bonding technology; advanced methods for SoC testing; wafer level packaging; wafer level manufacturing; new advances in DFM and DFT; SiP; sub-system advance processes; and MEMS packaging and test.
Keywords :
assembling; dielectric materials; environmental factors; integrated circuit manufacture; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated circuit yield; lead bonding; micromechanical devices; soldering; DFM; DFT; MEMS packaging; MEMS testing; SiP; SoC testing; advanced methods; device characterization; device modelling; electronics manufacturing poster sessions; emerging trends; green manufacturing; lead-free manufacturing; low-k dielectrics; manufacturing assembly; manufacturing reliability; stacked die; sub-system advance processes; wafer level manufacturing; wafer level packaging; wire bonding technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321613
