Lead-free solder flip chips on FR-4 substrates with different surface finishes, underfills and fluxes

Author

Sjoberg, Jonas ; Geiger, David A. ; Shangguan, Dongkai ; Castello, Todd

Author_Institution

Flextronics, Linkoping, Sweden

fYear

2004

fDate

July 14-16, 2004

Firstpage

31

Lastpage

36

Abstract

This study is focused on the assembly and reliability of 200-250um-pitch, lead-free (SnAgCu) flip chips on FR4 substrates. The impact of different PCB surface finishes (OSP and ENIG) was investigated from assembly and reliability perspectives. Different underfill materials (including an acid anhydrate-based material and two nonacid anhydrate-based materials) were evaluated for compatibility with the flux and lead-free solder bumps and process.

Keywords

flip-chip devices; integrated circuit reliability; printed circuits; solders; substrates; surface finishing; ENIG; FR-4 substrates; OSP; PCB surface finishes; SnAgCu; acid anhydrate; assembly; fluxes; lead-free solder bumps; lead-free solder flip chips; nonacid anhydrate; reliability; underfill materials; underfills; Assembly; Costs; Environmentally friendly manufacturing techniques; Flip chip; Lead; Nickel; Packaging; Substrates; Surface finishing; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International

ISSN

1089-8190

Print_ISBN

0-7803-8582-9

Type

conf

DOI

10.1109/IEMT.2004.1321628

Filename

1321628