Die attach quality control of 3D stacked dies

In this paper, we present a methodology that can be used to determine the die attach failures of packaged stacked die structures. After presenting the methodology simulation experiments show the applicability for stacked die packages. The accuracy issues are discussed by evaluating the first measured results. The results of blind tests measurements are also presented. With the evaluation of these measurements we demonstrate that the methodology is in fact applicable to find the location of the integrity problems also within packages containing stack dies.