Title :
The socket response to current packaging and test trends
Author :
Andes, Jamie ; Bogatin, Eric
Author_Institution :
Synergetix, USA
Abstract :
Denser, faster, cheaper are still the driving forces for semiconductor packages. Not only must the assembly infrastructure keep up, but the test infrastructure must evolve to meet the challenging needs of the packages. This means pitches at 0.4 mm and tighter bandwidths greater than 5 GHz, quick turn times, and reduced total cost of ownership.
Keywords :
probes; semiconductor device packaging; semiconductor device testing; assembly infrastructure; design for manufacture; high bandwidth applications; semiconductor device testing; semiconductor packages; socket response; spring contact probes; test infrastructure; test sockets; Assembly; Bandwidth; Coaxial cables; Manufacturing; Pins; Probes; Semiconductor device packaging; Sockets; Springs; Testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321639
