Title :
A GALS Delay-insensitive Self-timed Wrapper for Network on Chips
Author :
Guan, Xuguang ; Zhou, Duan ; Yang, Yintang ; Zhu, Zhangming
Author_Institution :
Inst. of Microelectron., Xidian Univ., Xi´´an, China
Abstract :
A novel globally asynchronous locally synchronous delay insensitive self-timed wrapper for network on chips is presented. To prevent the occurrence of data sampling error, the wrapper detects the read/write signal and controls the stoppable clock module to stop the clock when data come. Sender wrapper and receiver wrapper consist of C element and Null convention logic, and NULL signals can be inserted into output data automatically in order to guarantee the characteristics of on-chip delay insensitive. The wrapper resolves the work of delay matching and data loss issues in traditional bundled data protocol wrapper. Simulations under different fabrication variations are implemented based on SMIC 0.18 mum CMOS technology. Sender wrapper and receiver wrapper allow synchronous modules work at speed of 2.87 GHz and 2.59 GHz respectively with average dynamic power dissipation of 828.2 muW and 819.8 muW. Its advantages of high-speed low-power, delay-insensitive and no data losses make it a viable option for high-performance high-robustness interconnection of network-on-chip.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; network-on-chip; radio receivers; C element; GALS delay insensitive self-timed wrapper; SMIC CMOS technology; clock module; data sampling error; dynamic power dissipation; integrated circiut interconnection; network on chips; null convention logic; receiver wrapper; size 0.18 mum; synchronous modules; Automatic control; Automatic logic units; CMOS technology; Clocks; Delay; Error correction; Network-on-a-chip; Protocols; Sampling methods; Signal resolution; GALS; asynchronous circuit; dual-rail protocol; high-speed low-power; network on chips;
Conference_Titel :
Circuits, Communications and Systems, 2009. PACCS '09. Pacific-Asia Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-0-7695-3614-9
DOI :
10.1109/PACCS.2009.98