DocumentCode
3289117
Title
Latest development in chip scale package laser marking and micro laser marking
Author
Gu, Bo
Author_Institution
GSI Lumonics Inc., Wilmington, MA, USA
fYear
2004
fDate
July 14-16, 2004
Firstpage
144
Lastpage
146
Abstract
New laser marking technology has been developed to address emerging industrial challenges. Permanent, ridge and debris free, and high contrast shallow marks (less than 1 micron) on the silicon wafers are achieved by using this new laser technology. The viewing of these marks is independent of the view angle, which is very unique an desirable. We have also developed the so-called micro marking technology that allows the mark font size to be much less than 0.3mm.
Keywords
chip scale packaging; laser materials processing; microassembling; silicon; wafer bonding; chip scale package; laser marking technology; mark font size; microlaser marking; micromarking technology; silicon wafers; view angle; Atom optics; Atomic force microscopy; Chip scale packaging; Consumer electronics; Focusing; Laser beams; Optical microscopy; Scanning electron microscopy; Silicon; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
ISSN
1089-8190
Print_ISBN
0-7803-8582-9
Type
conf
DOI
10.1109/IEMT.2004.1321647
Filename
1321647
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