Title :
Latest development in chip scale package laser marking and micro laser marking
Author_Institution :
GSI Lumonics Inc., Wilmington, MA, USA
Abstract :
New laser marking technology has been developed to address emerging industrial challenges. Permanent, ridge and debris free, and high contrast shallow marks (less than 1 micron) on the silicon wafers are achieved by using this new laser technology. The viewing of these marks is independent of the view angle, which is very unique an desirable. We have also developed the so-called micro marking technology that allows the mark font size to be much less than 0.3mm.
Keywords :
chip scale packaging; laser materials processing; microassembling; silicon; wafer bonding; chip scale package; laser marking technology; mark font size; microlaser marking; micromarking technology; silicon wafers; view angle; Atom optics; Atomic force microscopy; Chip scale packaging; Consumer electronics; Focusing; Laser beams; Optical microscopy; Scanning electron microscopy; Silicon; Wafer scale integration;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321647
