Title :
A Thermal Study of Porous Si-pillared Montmorillonite with High Surface Area
Author :
Hongyan, Xu ; Xingtong, Chen ; Tinghai, Wang ; Yonggang, Wang
Author_Institution :
Coll. of Resources & Environ., Hebei Polytech. Univ., Tangshan, China
Abstract :
Depending on the fact that most pillared clays show poor thermal stability, the study on the synthesis of novel Si-pillared montmorillonites (Si-MMT) with high thermal stability have been carried out. Furthermore, powder X-ray diffraction (XRD), Fourier transformation infra-red spectra (FTIR), nitrogen adsorption-desorption isotherms were applied in order to study the thermal stability and mechanisms of the pillared materials. A mechanism corresponding to Si-MMT with a good thermal stability was thus established: after calcination, protons are liberated by dehydration or dehydroxylation. These protons disrupt the silicon-oxygen-aluminium bridges where there are Al substitutions in the tetrahedral sheet of the montmorillonite. Some of silicon and aluminum tetrahedra invert to react with the pillaring agents and yield covalent bonds which firmly fix the pillars to the host clay. The Si-MMT are thermally stable up to 800degC and possess large basal spacings of about 2.5 nm after thermal treatment at 800degC.
Keywords :
Fourier transform spectra; X-ray diffraction; adsorption; bonds (chemical); calcination; desorption; drying; elemental semiconductors; infrared spectra; porous semiconductors; silicon; surface morphology; thermal stability; Al; FTIR; Fourier transformation infrared spectra; Si; XRD; aluminium substitutions; aluminum tetrahedra; basal spacings; calcination; covalent bonds; dehydration; dehydroxylation; nitrogen adsorption-desorption isotherms; porous silicon-pillared montmorillonite; powder X-ray diffraction; silicon-oxygen-aluminium bridges; surface area; temperature 800 degC; thermal stability; thermal treatment; Bridges; Calcination; Infrared spectra; Nitrogen; Powders; Protons; Sheet materials; Thermal stability; X-ray diffraction; X-ray scattering; Si-pillared montmorillonites; montmorillonite; thermal stability;
Conference_Titel :
Circuits, Communications and Systems, 2009. PACCS '09. Pacific-Asia Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-0-7695-3614-9
DOI :
10.1109/PACCS.2009.11