Foreword

Polytronic 2005 is the 5th issue of the series of Conferences started in 2001 in Potsdam, Germany. This first conference, proposed by IZM Fraunhofer Berlin had consolidated the successful series of IEEE workshops and conferences on adhesives and polymers. The interest of this subject is significantly increasing and conferences have provided the unique opportunity for polymer developers and polymer users from the electronics and photonics industries to meet and discuss their ideas. Also at the present conference research papers cover a lot of aspects of adhesives and polymers in microelectronics and photonics, including new polymers, organic devices, polymers in packaging and adhesive applications. This year the Polytronic Conference is organized by the Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology. The conference takes place at the Mercure Panorama Hotel, which is situated in the central part of Wroclaw. Wroclaw, the capital of Lower Silesia in Poland. During the Conference more than 50 papers will be presented at 14 oral and one poster sessions. Authors represent 15 countries from Europe, Asia and North America.