Title :
Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
Author :
Morris, James E. ; Lee, Jeahuck ; Liu, Johan
Author_Institution :
Department of Electrical & Computer Engineering, Portland State University, P.O. Box 751, Portland, OR 97207-0751, USA
Abstract :
This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging applications in place of soldering technology.
Keywords :
Application software; Conductive adhesives; Conductivity; Electronics packaging; Independent component analysis; Lead; Polymers; Powders; Surface-mount technology; Tin;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on
Print_ISBN :
0-7803-9553-0
DOI :
10.1109/POLYTR.2005.1596485
