DocumentCode :
3290872
Title :
Selection criteria of press-materials and packaging conditions for power electron devices
Author :
Baranov, Valentine V. ; Emelyanov, Victor A. ; Kerentsev, Anatoly F. ; Anufriev, Dmitry L.
Author_Institution :
Scientific Industrial Amalgamation "Integral", Minsk, Belarus, Kazinetz Sq., Minsk, 220050, Belarus, vvb@bsuir.unibel.by, phone: +375 17 239-8689, fax: +375 17 231-0914
fYear :
2005
fDate :
23-26 Oct. 2005
Firstpage :
152
Lastpage :
154
Abstract :
Some design and technological restrictions of using known press-materials and packaging methods within package technology of power electron devices in the epoxy molded housings of ISOWATT-218 type have been examined. The results of experimental research of the device hermetic condition after their testing at high temperatures and humidity have been described. It is shown that a value of the housing thermal resistance for a certain press-material depends on process conditions, in particular depends on a velocity of the press-material injection into a form through founding channels. It has been discovered that the bigger diaphragm diameter (leading to increasing the velocity of the press-material injection into all parts of a press-form) leads to increase of the value of RT. Dependencies have a nonlinear character. The level of RTvalue depends on a press-material type. The conditions of packaging process with RTvalues of 2,5 - 3 °C / W have been founded for the press-materials MG-40F and EME 596. Decrease of an anti-adhesive grease that contains in the Russian press-material of MEP-5T type as well as the press-tablets prior heating exclusion leads to better quality of the plastic housing process formation.
Keywords :
Press-materials; epoxy molded housings; humidity and temperatures tests; package technology; power electron devices; Cooling; Electron devices; Humidity; Packaging; Plastics; Polymers; Temperature; Testing; Thermal conductivity; Thermal resistance; Press-materials; epoxy molded housings; humidity and temperatures tests; package technology; power electron devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on
Print_ISBN :
0-7803-9553-0
Type :
conf
DOI :
10.1109/POLYTR.2005.1596506
Filename :
1596506
Link To Document :
بازگشت