DocumentCode :
3290942
Title :
Research on the key techniques of ultrasonic debridement instrument
Author :
Ruining Huang ; Zhipeng Huang ; Yunjiang Lou
Author_Institution :
Shenzhen Grad. Sch., Shenzhen Key Lab. for Adv. Motion Control & Modern Autom. Equipments, Harbin Inst. of Technol., Shenzhen, China
fYear :
2013
fDate :
12-14 Dec. 2013
Firstpage :
740
Lastpage :
745
Abstract :
This paper presents a new type of intelligent ultrasonic power supply based on DSP and DDS, and then designed a debridement transducer. The ultrasonic power supply consist of TMS320F2812, DDS waveform generating circuit, Full-bridge inverter circuit, signal processing circuit and so on. In order to achieve frequency automatic tracking with the characteristics of high precision and fast speed, it adopted the control strategy of Integra separation PI algorithm and variable step size. Ultrasonic transducer is mainly composed of quarter wave oscillator and second order of the amplitude. Experiments show that both of the hardware and the software achieved the expect function, the ultrasonic power can achieve high precision frequency automatic tracking. Consequence, the results proved the designed method was feasible.
Keywords :
biomedical transducers; biomedical ultrasonics; bridge circuits; digital signal processing chips; direct digital synthesis; invertors; oscillators; power supplies to apparatus; ultrasonic therapy; ultrasonic transducers; waveform generators; DDS waveform generating circuit; DSP; TMS320F2812; debridement transducer; frequency automatic tracking; full bridge inverter circuit; integral separation PI algorithm; intelligent ultrasonic power supply; quarter wave oscillator; signal processing circuit; ultrasonic debridement instrument; variable step size; Acoustics; Digital signal processing; Impedance; Inverters; Power supplies; Resonant frequency; Transducers; frequency automatic tracking; ultrasonic power supply; ultrasonic transducer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Biomimetics (ROBIO), 2013 IEEE International Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/ROBIO.2013.6739549
Filename :
6739549
Link To Document :
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