• DocumentCode
    3290995
  • Title

    Wideband out-of-phase SIW power divider with enhanced stopband

  • Author

    Kaijun Song ; Yuxia Mo ; Shunyong Hu ; Yong Fan ; Ningbo Chen

  • Author_Institution
    EHF Key Lab. of Fundamental Sci., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A wideband multi-way out-of-phase substrate integrated waveguide (SIW) power divider with improved rejection band by using novel hybrid multiple-via probe and multiple radial slots has been presented in this letter. The novel hybrid multiple-via probe and multiple radial slots are employed to achieve wideband and improved rejection band respectively. An eight-way out-of-phase SIW power divider is designed, fabricated, and measured. Good agreement between simulated and measured results is obtained in the desirable frequency range. The measured average insertion loss of the eight-way power divider is approximately 9.3 dB and return loss is greater than 15 dB from 3.5 GHz to 8 GHz, as well as an rejection band with more than 25 dB attenuation from 9 GHz to 11.2 GHz. A maximum amplitude imbalance of ±0.3 dB and phase imbalance of ±3° are observed over the entire operating frequency range.
  • Keywords
    broadband networks; microwave integrated circuits; power dividers; substrate integrated waveguides; eight-way out-of-phase SIW power divider; frequency 3.5 GHz to 11.2 GHz; hybrid multiple-via probe; insertion loss; multiple radial slots; rejection band; return loss; substrate integrated waveguide; wideband out-of-phase SIW power divider; Frequency measurement; Optical waveguides; Power dividers; Power measurement; Probes; Substrates; Wideband; hybrid multiple-via probe; multiple radial slots; out-of-phase power divider; substrate integrated waveguide (SIW); wideband;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2013 IEEE International
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2013.6616702
  • Filename
    6616702