Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB´s

At last years the extreme demand on miniaturized, functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends on scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). The high level of integration of electronic components, such as Chip Size Packages (CSPs) or micro scale Ball Grid Arrays (μBGAs) determines the designers of electronic devices to create modern layouts. The using of appropriate materials on PCBs and using of newest techniques of manufacture creates the new possibilities of electronics application. At present, the polymers plays more and more important role in electronics, especially in flexible electronics. The big challenge is manufacture of connections and interconnections in polymer PCBs. In the paper the idea of interconnections metallization by using of magnetron sputtering deposition of copper is presented. Such process permits to metallize of interconnections based on microvias with high aspect ratio (deep/diameter) even about 5:1. The realized investigations show that the mentioned technology is the big success in domain of techniques of interconnections metallization and it is very promising for High Tech PCBs manufacturers.