DocumentCode
3291265
Title
Reliability aspects of electronics packaging technology using conductive adhesives
Author
Liu, Johan ; Lu, Xiu Zheng ; Liqiang Cao
Author_Institution
SMIT Center, Department of Microtechnology and Nanosciences, Chalmers University of Technology, SE-412 96, Göteborg, Sweden; Key State Lab of New Displays and System Integration, SMIT Center, Shanghai University, New Science and Technology Building N
fYear
2005
fDate
23-26 Oct. 2005
Firstpage
235
Lastpage
235
Abstract
Conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last decades. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed that conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for conductive adhesives in various applications.
Keywords
CD-ROMs; Conductive adhesives; Displays; Electronics packaging; Microelectronics; Paper technology; Photonics; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on
Print_ISBN
0-7803-9553-0
Type
conf
DOI
10.1109/POLYTR.2005.1596527
Filename
1596527
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