DocumentCode :
329138
Title :
Fabrication Of SOI Wafers With Buried Cavities Using Silicon Fusion Bonding And Electrochemical Etchback
Author :
Noworolski, J. Mark ; Klaassen, Erno ; Logan, John ; Petersen, Kurt ; Maluf, Nadim
Author_Institution :
UC Berkeley
Volume :
1
fYear :
1995
fDate :
25-29 Jun 1995
Firstpage :
71
Lastpage :
74
Keywords :
Actuators; Costs; Crystalline materials; Etching; Fabrication; Manufacturing; Micromechanical devices; Silicon on insulator technology; Thickness control; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
Type :
conf
DOI :
10.1109/SENSOR.1995.717090
Filename :
717090
Link To Document :
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