DocumentCode

329144

Title

Selective Seeding Of Copper Films On Polyimide Patterned Silicon Substrate, Using Ion Implantation

Author

Bhansali, S. ; Sood, D.K.

Author_Institution

Royal Melbourne Institute of Technology

Volume

1

fYear

1995

fDate

25-29 Jun 1995

Firstpage

95

Lastpage

98

Keywords

Chemicals; Copper; Etching; Fabrication; Ion implantation; Lithography; Polyimides; Resists; Semiconductor films; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

conf

DOI

10.1109/SENSOR.1995.717100

Filename

717100