Title :
Nondestructive characterization of diamond films
Author :
Weglein, R.D. ; Kim, Jin O.
Abstract :
Work towards developing a means of nondestructively estimating several key parameters of diamond-like-carbon (DLC) films, such as film thickness, film adhesion and film material constituency, is described. DLC-layered structures show great promise in industry where extremely hard, protective coatings and high heat transfer are crucial. Several specimens of DLC-coated ⟨100⟩ silicon substrates with a film thickness range between 0.7 and 9 μm were investigated using acoustic microscopes with spherical and cylindrical acoustic lens systems in the frequency range between 200 and 600 MHz. The experimental results are discussed and compared with computed surface acoustic wave dispersion curves using published bulk material elastic constants
Keywords :
acoustic microscopy; adhesion; diamond; semiconductor thin films; surface acoustic waves; thickness measurement; ultrasonic dispersion; ultrasonic materials testing; 0.7 to 9 micron; 200 to 600 MHz; C; Si substrates; acoustic microscopy; cylindrical acoustic lens; diamond like carbon films; elastic constants; film adhesion; film material constituency; film thickness; spherical acoustic lens; surface acoustic wave dispersion curves; Adhesives; Coatings; Heat transfer; Microscopy; Optical materials; Parameter estimation; Protection; Semiconductor films; Silicon; Substrates;
Conference_Titel :
Ultrasonics Symposium, 1991. Proceedings., IEEE 1991
Conference_Location :
Orlando, FL
DOI :
10.1109/ULTSYM.1991.234095
