Title :
Hermeticity Testing Of Glass-silicon Packages With On Chip Feed Throughs
Author :
Arx, J.V. ; Ziaie, B. ; Dokmeci, M. ; Najafi, K.
Author_Institution :
University of Michigan
Keywords :
Bonding; Circuit testing; Fabrication; Feeds; Glass; Hermetic seals; Ocean temperature; Packaging; Sea surface; Silicon;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717156
