DocumentCode

329176

Title

Hermeticity Testing Of Glass-silicon Packages With On Chip Feed Throughs

Author

Arx, J.V. ; Ziaie, B. ; Dokmeci, M. ; Najafi, K.

Author_Institution

University of Michigan

Volume

1

fYear

1995

fDate

25-29 Jun 1995

Firstpage

244

Lastpage

247

Keywords

Bonding; Circuit testing; Fabrication; Feeds; Glass; Hermetic seals; Ocean temperature; Packaging; Sea surface; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

conf

DOI

10.1109/SENSOR.1995.717156

Filename

717156