Title :
Optimizing electromechanical coupling in piezocomposites using polymers with negative Poisson´s ratio
Author :
Smith, Wallace Arden
Author_Institution :
US Office of Naval Res., Arlington, VA, USA
Abstract :
The invention of methods to make new materials with an engineered microstructure that yields a negative Poisson ratio opens a new avenue to optimize the performance of piezoelectric-rod/polymer-matrix composites. Such negative Poisson´s ratio materials can be used as the passive phase in the composite to redirect the external stress acting on the piezocomposite so that the resulting stress bearing on the piezoceramic rods produces a maximal piezoelectric response. To project the properties of such a piezocomposite, a simple physical model that assumes constant strain along the rods and constant stress in the perpendicular plane is used. Interesting opportunities to improve the performance of devices made from 1-3 piezocomposites are seen in results calculated for the thickness-mode electromechanical coupling constant relevant to pulse-echo ultrasonic applications and for the hydrostatic electromechanical coupling constant relevant to passive hydrophones
Keywords :
Poisson ratio; acoustic imaging; ceramics; composite materials; hydrophones; piezoelectric materials; piezoelectric transducers; polymers; stress-strain relations; ultrasonic applications; ultrasonic transducers; 1-3 piezocomposites; constant strain; constant stress; electromechanical coupling optimization; external stress; hydrophone receivers; hydrostatic electromechanical coupling constant; negative Poisson ratio; passive hydrophones; piezoceramic rods; piezoelectric-rod/polymer-matrix composites; polymers; pulse-echo ultrasonic applications; thickness mode transducers; thickness-mode electromechanical coupling constant; Anisotropic magnetoresistance; Capacitive sensors; Ceramics; Contracts; Energy conversion; Microstructure; Piezoelectric materials; Polymers; Solids; Titanium compounds;
Conference_Titel :
Ultrasonics Symposium, 1991. Proceedings., IEEE 1991
Conference_Location :
Orlando, FL
DOI :
10.1109/ULTSYM.1991.234109