DocumentCode

329248

Title

A Novel Etch-diffusion Process For Fabricating High Aspect Ratio Si Microstructures

Author

Juan, W.H. ; Pang, S.W.

Author_Institution

The University of Michigan

Volume

1

fYear

1995

fDate

25-29 Jun 1995

Firstpage

560

Lastpage

563

Keywords

Diffusion processes; Dry etching; Microsensors; Microstructure; Plasma applications; Plasma sources; Polymers; Resonance; Wafer bonding; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

conf

DOI

10.1109/SENSOR.1995.717286

Filename

717286