Title :
26th Annual Proceedings. Reliability Physics 1988 (Cat. No.88CH2508-0)
Abstract :
The following topics are dealt with: electromigration; dielectrics; device reliability; packaging; metallization; corrosion; electrostatics and hot carriers; MOSFETs; MOS transistors; hot electrons; CMOS circuits; contacts; thermal sintering; VLSI devices; wafers; surface mounting devices; plastic encapsulation; soldering; MODFETs; GaAs substrates; microscopy; failure mechanisms; annealing; memories; interconnections; IC fabrication; avionic equipment; and thin-film conductors. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
VLSI; annealing; corrosion; electromigration; electrostatics; encapsulation; failure analysis; hot carriers; integrated circuit testing; integrated memory circuits; metallisation; packaging; reliability; semiconductor device testing; soldering; CMOS circuits; GaAs substrates; IC fabrication; MODFETs; MOS transistors; MOSFETs; VLSI devices; annealing; avionic equipment; contacts; corrosion; device reliability; dielectrics; electromigration; electrostatics; failure mechanisms; hot carriers; interconnections; memories; metallization; microscopy; packaging; plastic encapsulation; soldering; surface mounting devices; thermal sintering; thin-film conductors; wafers;
Conference_Titel :
Reliability Physics Symposium 1988. 26th Annual Proceedings., International
Conference_Location :
Monterey, CA, USA
DOI :
10.1109/RELPHY.1988.23415
