DocumentCode
3292683
Title
Packaging in the IT environment: competing challenges in the design of packaging for electronic products
Author
Horbal, John ; Schaffer, Mark
Author_Institution
World Wide Packaging, Shock & Vibe, Dell Inc., USA
fYear
2005
fDate
16-19 May 2005
Firstpage
93
Lastpage
95
Abstract
Provide an overview of packaging design considerations through modeling and testing to optimize packaging for electronic products and to provide details of the packaging challenge from an environmental perspective.
Keywords
electronic products; electronics packaging; environmental factors; IT environment; electronic products packaging; packaging design; Accelerometers; Design optimization; Electric shock; Electronic equipment testing; Electronics packaging; Frequency; Gravity; Protection; Raw materials; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2005. Proceedings of the 2005 IEEE International Symposium on
ISSN
1095-2020
Print_ISBN
0-7803-8910-7
Type
conf
DOI
10.1109/ISEE.2005.1437000
Filename
1437000
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