Title :
Case study: multi life cycle center for electronic products
Author :
Knoth, R. ; Kopacek, B. ; Kopacek, P.
Author_Institution :
Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
Abstract :
This case study shows the implementation of a highly innovative re-use and recycling system for waste of electric and electronic equipment (WEEE). This so-called multi life cycle centre will make use of the latest development in automation and information technology in order to obtain an efficient economical and ecological process. In this centre, implemented as pilot plant in Vienna, Austria, WEEE will be transformed back into valuable products. The product groups treated for re-use include IT and telecommunication equipment, consumer electronics, electrical and electronic tools, toys and leisure equipment. Regarding all other product groups the collection and recycling will be organized. The management of the reverse logistic system is based on RFID technology (radio frequency identification). The multi life cycle centre follows the philosophy to recover WEEE at the highest possible level, starting with re-use of the whole product down to the subassembly and component level and finally to the recycling of materials. This approach is unique in the world and we are going to prove that an eco-efficient re-use of WEEE on a large scale can be feasible by using highly sophisticated technologies. The presented paper gives an overview of the various functions of the multi life cycle centre and highlights two key technologies: semi automatic disassembling and reverse logistic based on RFIDs.
Keywords :
electronic products; product design; recycling; eco-efficiency; electronic products; multi life cycle center; recycling system; reuse system; waste of electric and electronic equipment; Automation; Consumer electronics; Electronic equipment; Electronic waste; Information technology; Radio spectrum management; Radiofrequency identification; Recycling; Reverse logistics; Technology management;
Conference_Titel :
Electronics and the Environment, 2005. Proceedings of the 2005 IEEE International Symposium on
Print_ISBN :
0-7803-8910-7
DOI :
10.1109/ISEE.2005.1437022