DocumentCode :
3293163
Title :
Analysis and Risk Communication of 20 Years of Exposure Monitoring of Photolithography Solvents from all Intel Fabs
Author :
Hunsaker, Harry
Author_Institution :
Intel Corp., Rio Rancho
fYear :
2006
fDate :
25-27 Sept. 2006
Firstpage :
35
Lastpage :
38
Abstract :
Twenty years of air sampling of 16 volatile solvents in photolithography from Intel fabs were analyzed. The 95% upper confidence limit of the 95th percentile of the samples were one-half or less than the full-shift occupational exposure limits. Each air sample was converted to a single, 15-minute exposure for comparison to the short-term exposure limits (STEL). The calculation indicated it was unlikely that the STEL values were exceeded. Inhalation exposures to the solvents have been acceptably low and well controlled for full-shift and for short-term exposure durations over many generations of processes, process equipment, and job duties.
Keywords :
integrated circuit manufacture; monitoring; occupational health; photolithography; risk analysis; solvents (industrial); Intel Fabs; air sampling; exposure monitoring; full-shift occupational exposure limits; inhalation exposures; photolithography solvents; risk communication; short-term exposure limits; time 15 min; Chemical industry; Employment; Lithography; Monitoring; Protection; Resists; Risk analysis; Risk management; Sampling methods; Solvents;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-4-9904138-0-4
Type :
conf
DOI :
10.1109/ISSM.2006.4493016
Filename :
4493016
Link To Document :
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