Application of Atmospheric Plasma Abatement System for Exhausted Gas from MEMS Etching Process

Author

Hattori, Kenji ; Sakurai, Kazuhiko ; Watanabe, Nobuaki ; Mangyou, Hirotaka ; Hasaka, Satoshi ; Shibuya, Kazunobu

Author_Institution

Taiyo Nippon Sanso Corp., Kawasaki

fYear

2006

fDate

25-27 Sept. 2006

Firstpage

39

Lastpage

42

Abstract

For the reduction of global warming potential (GWP) gases such as PFCs from semiconductor manufacturing process, we have developed an atmospheric plasma abatement system that has high decomposition efficiency. We have applied the plasma abatement system for decomposition of PFCs in exhausted gas from MEMS (micro electro mechanical system) etching process and have carried out the beta test. We have demonstrated that the plasma abatement system was available for MEMS etching process with high efficiency and durability for reduction of PFCs emission during stable operation.

Keywords

air pollution control; etching; global warming; micromechanical devices; plasma applications; MEMS etching process; atmospheric plasma abatement system; exhausted gas; global warming potential gas reduction; microelectromechanical system; semiconductor manufacturing process; Etching; Gases; Global warming; Manufacturing processes; Mechanical systems; Micromechanical devices; Plasma applications; Plasma materials processing; Plasma stability; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

978-4-9904138-0-4

Type

conf

DOI

10.1109/ISSM.2006.4493017

Filename

4493017