DocumentCode :
3293186
Title :
Application of Atmospheric Plasma Abatement System for Exhausted Gas from MEMS Etching Process
Author :
Hattori, Kenji ; Sakurai, Kazuhiko ; Watanabe, Nobuaki ; Mangyou, Hirotaka ; Hasaka, Satoshi ; Shibuya, Kazunobu
Author_Institution :
Taiyo Nippon Sanso Corp., Kawasaki
fYear :
2006
fDate :
25-27 Sept. 2006
Firstpage :
39
Lastpage :
42
Abstract :
For the reduction of global warming potential (GWP) gases such as PFCs from semiconductor manufacturing process, we have developed an atmospheric plasma abatement system that has high decomposition efficiency. We have applied the plasma abatement system for decomposition of PFCs in exhausted gas from MEMS (micro electro mechanical system) etching process and have carried out the beta test. We have demonstrated that the plasma abatement system was available for MEMS etching process with high efficiency and durability for reduction of PFCs emission during stable operation.
Keywords :
air pollution control; etching; global warming; micromechanical devices; plasma applications; MEMS etching process; atmospheric plasma abatement system; exhausted gas; global warming potential gas reduction; microelectromechanical system; semiconductor manufacturing process; Etching; Gases; Global warming; Manufacturing processes; Mechanical systems; Micromechanical devices; Plasma applications; Plasma materials processing; Plasma stability; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-4-9904138-0-4
Type :
conf
DOI :
10.1109/ISSM.2006.4493017
Filename :
4493017
Link To Document :
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