• DocumentCode
    3293266
  • Title

    300mm Time Constrained Queue Loop Management

  • Author

    Van Sickle, David L. ; Hertzler, Erik F.

  • Author_Institution
    Intel, Chandler
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    57
  • Lastpage
    60
  • Abstract
    Prior process technology experience identified several segments in 300 mm process flows as cycle-time sensitive. The time between a wafer leaving an operation and being processed at a subsequent operation must be managed or else process defects may occur. These time constrained steps are referred to as "queue loops" because wafers are held in queue until there is high confidence they can be processed within the predetermined timeframe. The problem resides in synchronizing production capacity within each loop while balancing factory favorable cycle-time and cost effective toolset capacity. This paper will discuss the simulation modeling methodology that was utilized to analyze the trade-offs between output and quality-induced operational controls under varying wafer start levels.
  • Keywords
    computer integrated manufacturing; semiconductor process modelling; wafer bonding; factory cycle-time; operational control; production capacity ynchronisation; semiconductor process modelling; size 300 mm; time constrained queue loop management; toolset capacity; wafer bonding; Analytical models; Costs; Degradation; Engines; Manufacturing processes; Production facilities; Semiconductor device modeling; Technology management; Throughput; Time factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493022
  • Filename
    4493022