• DocumentCode
    3293289
  • Title

    Supply Chain Inventory Control in Semiconductor Manufacturing

  • Author

    Guo, Ruey-Shan ; Chiang, David ; Yang, Po-Chun

  • Author_Institution
    Nat. Taiwan Univ., Taipei
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    66
  • Lastpage
    69
  • Abstract
    As the semiconductor industry faces more and more fierce competition, it is essential for semiconductor supply chain to integrate back-end and front-end to provide better service to customers. This research develops a semiconductor supply chain monitoring scheme based on the concept of echelon WIP inventory and CONWIP system. The first step in the proposed scheme is to construct a two-echelon model with the goal of minimizing the echelon WIP inventory control limits under target service levels. Next, this two-echelon model is extended to a multi-echelon model. The proposed scheme has been validated through simulation study. Based on the simulation validation results, conclusions are drawn as follows: 1) The proposed scheme can derive the multi-echelon WIP inventory limits effectively; 2) Compared to the traditional stage-based inventory monitoring scheme, the proposed echelon-based monitoring scheme can obtain a higher service level with lower inventory levels.
  • Keywords
    semiconductor device manufacture; stock control; supply chain management; CONWIP system; echelon WIP inventory control limits; multi-echelon model; semiconductor industry; semiconductor manufacturing; semiconductor supply chain; semiconductor supply chain monitoring scheme; supply chain inventory control; two-echelon model; Electronics industry; Industrial engineering; Inventory control; Lead compounds; Monitoring; Production systems; Routing; Semiconductor device manufacture; Supply chain management; Supply chains;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493024
  • Filename
    4493024