Troubleshooting Tracks with Vibration Detection and Storage Technology

Author

Wahner, Lester J.

Author_Institution

Intel Corp., Rio Rancho

fYear

2006

fDate

25-27 Sept. 2006

Firstpage

78

Lastpage

81

Abstract

Scrapped wafers and excursions caused by wafer handling has been an on going concern. Serious tool problems that don´t get adequately addressed in typical PM protocols are part of the issue. Capturing wafer handling issues before they become excursions is paramount. A vibration detection device has been deployed at Intel. It is a vibration sensor, digital signal storage, and battery mounted on a silicon wafer. It collects vibrations comparable to those experienced by production wafers. By running it through the tool on standardized recipes, identifiable and characteristic waveforms are collected. The development work is the analysis, interpretation, and corrective action association of these waveforms.

Keywords

materials handling; semiconductor device manufacture; sensors; vibration measurement; Intel; digital signal storage; excursions; scrapped wafers; vibration detection device; vibration sensing wafer; vibration sensor; wafer handling; Batteries; Image databases; Manufacturing; Production; Resists; Signal analysis; Signal processing; Software packages; Time domain analysis; Vibration measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

978-4-9904138-0-4

Type

conf

DOI

10.1109/ISSM.2006.4493027

Filename

4493027