DocumentCode :
3293348
Title :
Increased Etch Chamber Productivity through the Reduction of Unscheduled Wet Cleans
Author :
Ames, Brent
Author_Institution :
Metron Technol. Inc., Austin
fYear :
2006
fDate :
25-27 Sept. 2006
Firstpage :
82
Lastpage :
84
Abstract :
Unscheduled wet cleans on etch chambers can have a large impact on tool availability. Metron has developed a cleaning technology which eliminates the need to open etch chambers to clean particulates off electrostatic chucks, handling equipment, and transfer chambers. Referred to as the chamber maintenance wafer (CMW), this new tool is able to embed particulates and remove them from the chamber without causing contamination. The cleaning wafer also eliminates backside metal contamination in vacuum systems. This paper will review the typical results of the CMW in high volume production fabs focusing on the impact to chamber availability on etch systems.
Keywords :
decontamination; etching; integrated circuit manufacture; production equipment; productivity; Metron; chamber maintenance wafer; cleaning technology; contamination; electrostatic chucks; etch chamber productivity; tool availability; unscheduled wet cleans; vacuum systems; Cleaning; Contamination; Costs; Electrostatics; Geometry; Polymer films; Productivity; Semiconductor device manufacture; Silicon; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
978-4-9904138-0-4
Type :
conf
DOI :
10.1109/ISSM.2006.4493028
Filename :
4493028
Link To Document :
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