DocumentCode :
3293360
Title :
Fabrication of volcano emitters using chemical mechanical polishing (CMP)
Author :
Busta, H. ; Gammie, G. ; Skala, S. ; Fury, M. ; Stell, M. ; Myers, T.
Author_Institution :
Coloray Display Corp., Fremont, CA, USA
fYear :
1996
fDate :
7-12 Jul 1996
Firstpage :
388
Lastpage :
392
Abstract :
Volcano emitters with gate dimensions of 6, 9, 15, 25, and 50 μm have been processed using chemical mechanical polishing (CMP) for the removal of the emitter material and the gate-to-emitter dielectric on top of the gate plateau. Devices were fabricated with Cr, Cr-cermet, TiW/Au, SiC, and SiC/TiW/Au as the emitter materials and with 1 μm spacings between the emitter rims and the silicon gates. The gate post heights ranged from 4 to 6 μm. Measurements of single volcano SiC and SiC/TiW/Au emitters showed that the emission current scales with the periphery of the devices. CMP offers a readily scaleable process for the manufacturing of large area FEDs
Keywords :
electron field emission; large screen displays; polishing; vacuum microelectronics; 4 to 6 micron; 6 to 50 micron; Cr; SiC; SiC-TiW-Au; TiW-Au; chemical mechanical polishing; emission current; emitter material; emitter rims; gate dimensions; gate plateau; gate post heights; gate-to-emitter dielectric; large area FEDs; volcano emitters; Chemical processes; Chromium; Current measurement; Dielectric materials; Dielectric measurements; Fabrication; Gold; Manufacturing processes; Silicon carbide; Volcanoes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Microelectronics Conference, 1996. IVMC'96., 9th International
Conference_Location :
St. Petersburg
Print_ISBN :
0-7803-3594-5
Type :
conf
DOI :
10.1109/IVMC.1996.601848
Filename :
601848
Link To Document :
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