Title :
Wire Bonder Mis-Process Reduction and Productivity Improvement with Full Automation System by Cross Regional Team
Author :
Theam, Tay Chai ; Miyake, Kenji ; Minor, Karl ; Maruoka, Motoaki ; Watanabe, Shingo ; Angeles, Elsa ; Micua, Jose Dennis ; Lu, Louis
Author_Institution :
Texas Instrum. Inc., Kuala Lumpur
Abstract :
This paper will discuss an approach and solution to effective used software automation to improve productivity and product quality in all TI assembly plants. The project team include members from United States, Malaysia, Philippine, Republic of China, Mexico and Japan. As ONE IT team, project members developed this system and fan-out the software to their respective plant. With developers from many countries, a good project management is a must to execute the plan. The team used weekly teleconference and net-meeting to update the status and discuss any obstacles facing by each member, until the success of the project.
Keywords :
lead bonding; project management; cross regional team; net-meeting; productivity improvement; project management; software automation; teleconference; wire bonder misprocess reduction; Assembly; Automation; Bonding; Certification; Gold; Instruments; Production; Productivity; Semiconductor devices; Wire;
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-4-9904138-0-4
DOI :
10.1109/ISSM.2006.4493029