DocumentCode
3293430
Title
Deposition of a-Si:H thin films embedded with nano-crystalline through dilution of argon
Author
Li, Zhi ; Li, Wei ; Cai, Haihong ; Gong, Yuguang ; Jiang, Yadong
Author_Institution
State Key Lab. of Electron. Thin Films &Integrated Devices, UESTC, Chengdu, China
fYear
2009
fDate
6-10 July 2009
Firstpage
567
Lastpage
571
Abstract
The structure of hydrogenated amorphous silicon (a-Si:H) thin films embedded with nano-crystal grains deposited by conventional radio frequency (RF) plasma enhanced chemical vapor deposition (PECVD) through decomposition of silane diluted with argon has been studied by X-ray diffraction (XRD), Fourier transform infrared (FTIR) and Raman spectroscopy. It is observed that argon as dilution gas plays a significant role in the growth of nano-crystal grains and amorphous network in a-Si:H thin films. The structural variation of the thin films with different dilution ratios suggests that changing of plasma conditions in the chamber leads to the nanocrystallizing of the thin films. The nanocrystallization process initiating at a relatively low dilution ratio has been observed. Moreover, a positive effect of argon dilution on the nanocrystallization has also been observed. The structural changes studied under argon dilution are explained by a proposed model based on the energy exchange between argon plasma constituted of Ar* and A+ radicals and the growth region of the thin films.
Keywords
Fourier transform spectra; Raman spectra; X-ray diffraction; amorphous semiconductors; crystallisation; dissociation; elemental semiconductors; hydrogen; infrared spectra; nanostructured materials; plasma CVD; semiconductor growth; semiconductor thin films; silicon; Fourier transform infrared spectroscopy; Raman spectroscopy; Si:H; X-ray diffraction; argon dilution; dilution gas; hydrogenated amorphous silicon; nano-crystal grain growth; nano-crystal grains; nano-crystalline; nanocrystallization process; radio frequency plasma enhanced chemical vapor deposition; thin films deposition; Amorphous silicon; Argon; Chemical vapor deposition; Plasma chemistry; Plasma x-ray sources; Radio frequency; Semiconductor thin films; Sputtering; Transistors; X-ray diffraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232581
Filename
5232581
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