• DocumentCode
    3293485
  • Title

    Characterization of substrate material using complementary split ring resonators at terahertz frequencies

  • Author

    Xi-Cheng Zhu ; Wei Hong ; Ke Wu ; Hong-Jun Tang ; Zhang-Cheng Hao ; Hou-Xing Zhou

  • Author_Institution
    State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents an approach of characterization of substrate material using complementary split ring resonator (CSRR). Frequency selective surfaces made from CSRR are excited with free space radiation. The dielectric properties of substrate material can be extracted from resonant frequencies and transmission loss at resonant frequencies. In order to verify the proposed method, the complex permittivity of Silicon substrate is measured from 110GHz to 180GHz by using backward-wave oscillator (BWO) spectrometers. And the measurement results show that the dielectric properties of Silicon substrate remain almost the same as that provided by semiconductor foundry at microwave frequencies.
  • Keywords
    backward wave oscillators; dielectric loss measurement; dielectric losses; dielectric materials; elemental semiconductors; permittivity; permittivity measurement; silicon; substrates; terahertz wave spectra; Si; backward-wave oscillator spectrometers; complementary split ring resonators; complex permittivity; dielectric properties; free space radiation; frequency 110 GHz to 180 GHz; frequency selective surfaces; resonant frequencies; silicon substrate; substrate material characterization; terahertz frequencies; transmission loss; Dielectrics; Frequency selective surfaces; Permittivity measurement; Resonant frequency; Semiconductor device measurement; Substrates; Frequency selective surface (FSS); backward-wave oscillator (BWO); complementary split ring resonator (CSRR); complex permittivity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2013 IEEE International
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2013.6616829
  • Filename
    6616829