Title :
A study of combining FIB circuit edit and OBIRCH technology for failure analysis
Author :
Yan, JingLin ; Xuesen Liu ; Liu, Mike ; YiLing Liu
Author_Institution :
Shanghai FALAB Test Technol. Co., Ltd., Suzhou, China
Abstract :
This paper discusses combining focused ion beam (FIB) circuit edit with OBIRH technology. FIB can cut or rewire an integrated circuit. OBIRCH can locate failure location. If FIB circuit edit & OBIRCH were applied at the same time, we can locate the failure site and find the root cause of the failure. The paper share one case of failure analysis and present advanced FIB technology.
Keywords :
failure analysis; focused ion beam technology; integrated circuit reliability; IC failure analysis; OBIRH technology; focused ion beam circuit edit; Circuits; Failure analysis; Heating; Infrared imaging; Semiconductor devices; Temperature distribution; Temperature sensors; Testing; Thermal engineering; Thermal resistance;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232588
