Title :
Thermal analysis of ICS based on equivalent thermal resistance and skill language
Author :
Zhang, Bin ; Su, Rong ; Feng, Shiwei ; Zhang, Guangchen ; Guo, Chunsheng ; Liu, Yin ; Ding, Kaikai
Author_Institution :
Sch. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
Abstract :
The thermal analysis of ICs has been studied in different methods for years. In this paper, a new method to analyze the steady-state temperature distribution of integrated circuit is presented. According to equivalent thermal resistance formula obtaining by an aid tool ANSYS and programming idea, the temperature distribution graph of an analog integrated circuit is obtained. And the result is verified by a complete ANSYS analysis.
Keywords :
analogue integrated circuits; temperature distribution; thermal analysis; thermal management (packaging); ANSYS; analog integrated circuit; equivalent thermal resistance; integrated circuits; skill language; steady-state temperature distribution; temperature distribution graph; thermal analysis; Analog integrated circuits; Circuit simulation; Circuit synthesis; Electronic packaging thermal management; Information analysis; Steady-state; Temperature distribution; Thermal engineering; Thermal resistance; Very large scale integration;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232590
