Title :
Advanced dynamic failure analysis on interconnects by vectorized Scanning Joule Expansion microscopy
Author :
Tiedemann, A.K. ; Fakhri, M. ; Heiderhoff, R. ; Phang, J.C.H. ; Balk, L.J.
Author_Institution :
Dept. of Electron., Univ. of Wuppertal, Wuppertal, Germany
Abstract :
Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions.
Keywords :
equivalent circuits; failure analysis; integrated circuit interconnections; thermoelasticity; thermomechanical treatment; advanced dynamic failure analysis; degradation processes; equivalent circuits; frequency behaviors; interconnects; spatial resolutions; temperature sensitivity; thermal-mechanical system; thermoelastic transport mechanisms; vectorized scanning Joule expansion microscopy; vertical and lateral scanning Joule expansion microscopy measurements; Cutoff frequency; Failure analysis; Integrated circuit interconnections; Resonance; Scanning probe microscopy; Spatial resolution; Temperature sensors; Thermal conductivity; Thermal expansion; Thermal force;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232596
