Advanced dynamic failure analysis on interconnects by vectorized Scanning Joule Expansion microscopy

Author

Tiedemann, A.K. ; Fakhri, M. ; Heiderhoff, R. ; Phang, J.C.H. ; Balk, L.J.

Author_Institution

Dept. of Electron., Univ. of Wuppertal, Wuppertal, Germany

fYear

2009

fDate

6-10 July 2009

Firstpage

515

Lastpage

519

Abstract

Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions.

Keywords

equivalent circuits; failure analysis; integrated circuit interconnections; thermoelasticity; thermomechanical treatment; advanced dynamic failure analysis; degradation processes; equivalent circuits; frequency behaviors; interconnects; spatial resolutions; temperature sensitivity; thermal-mechanical system; thermoelastic transport mechanisms; vectorized scanning Joule expansion microscopy; vertical and lateral scanning Joule expansion microscopy measurements; Cutoff frequency; Failure analysis; Integrated circuit interconnections; Resonance; Scanning probe microscopy; Spatial resolution; Temperature sensors; Thermal conductivity; Thermal expansion; Thermal force;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the

Conference_Location

Suzhou, Jiangsu

ISSN

1946-1542

Print_ISBN

978-1-4244-3911-9

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2009.5232596

Filename

5232596