Title :
Combining influential analysis of bonding temperature and power on bonding quality
Author :
Zhang, Yanan ; Han, Lei
Author_Institution :
Coll. of Mech. & Electr. Eng., Central South Univ., Changsha, China
Abstract :
The bonding quality as obtained by strength tests of thermosonic bonding has been investigated as function of bonding temperature and ultrasonic power. The results show that bonding quality is very sensitive to process temperature and power. Optimum bonding temperature is not identical at different ultrasonic power. Analogously, optimum ultrasonic power which appears between 0.36 W and 0.95 W is not identical at different bonding temperature. The success rate of bonding is nearly 100% except for bonding temperature of 50degC and ultrasonic power of 0.035 W. Meanwhile, their match is important. The combining influence of bonding temperature and power on bonding quality is analyzed by the interpolation of mean strength. The obtained data were useful for further researches.
Keywords :
integrated circuit bonding; interpolation; tape automated bonding; bonding quality; bonding temperature; interpolation; mean strength; strength tests; thermosonic bonding; ultrasonic power; Aluminum; Bonding forces; Bonding processes; Educational institutions; Gold; Microelectronics; Packaging; Temperature sensors; Ultrasonic variables measurement; Wire;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location :
Suzhou, Jiangsu
Print_ISBN :
978-1-4244-3911-9
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2009.5232597
