Combining influential analysis of bonding temperature and power on bonding quality

Author

Zhang, Yanan ; Han, Lei

Author_Institution

Coll. of Mech. & Electr. Eng., Central South Univ., Changsha, China

fYear

2009

fDate

6-10 July 2009

Firstpage

503

Lastpage

506

Abstract

The bonding quality as obtained by strength tests of thermosonic bonding has been investigated as function of bonding temperature and ultrasonic power. The results show that bonding quality is very sensitive to process temperature and power. Optimum bonding temperature is not identical at different ultrasonic power. Analogously, optimum ultrasonic power which appears between 0.36 W and 0.95 W is not identical at different bonding temperature. The success rate of bonding is nearly 100% except for bonding temperature of 50degC and ultrasonic power of 0.035 W. Meanwhile, their match is important. The combining influence of bonding temperature and power on bonding quality is analyzed by the interpolation of mean strength. The obtained data were useful for further researches.

Keywords

integrated circuit bonding; interpolation; tape automated bonding; bonding quality; bonding temperature; interpolation; mean strength; strength tests; thermosonic bonding; ultrasonic power; Aluminum; Bonding forces; Bonding processes; Educational institutions; Gold; Microelectronics; Packaging; Temperature sensors; Ultrasonic variables measurement; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the

Conference_Location

Suzhou, Jiangsu

ISSN

1946-1542

Print_ISBN

978-1-4244-3911-9

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2009.5232597

Filename

5232597