Title :
High Throughput AMHS Design with Dual Unified OHT System
Author :
Han, ChungSoo ; Paré, Keith ; Tokumoto, Mitsuya ; Aoki, Aijiro
Author_Institution :
Spansion LLC, Austin
Abstract :
The high throughput automated material handling system (AMHS) is required to support carrier delivery requirement of 300 mm prime and 450 mm wafer fab. The unified overhead hoisting transport (OHT) system has been used for 300 mm fab to get high throughput and short delivery time; however, it has throughput limitations because of vehicle traffic congestion, especially in the interbay area. This paper describes the dual unified OHT (DUO) system, a new track layout system to reduce interbay congestion and improve delivery throughput. A simulation result is included to compare the throughput performance of the DUO and single unified OHT (SUO) system.
Keywords :
lifting; carrier delivery requirement; dual unified OHT system; high throughput AMHS design; high throughput automated material handling system; interbay congestion; single unified OHT system; unified overhead hoisting transport system; vehicle traffic congestion; Buffer storage; Design automation; Dispatching; Machinery; Magnetic heads; Materials handling; Metrology; Throughput; Traffic control; Vehicle dynamics;
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-4-9904138-0-4
DOI :
10.1109/ISSM.2006.4493056
