Title :
Application of quality engineering in semiconductor wafer process
Author :
Murashima, Shigenobu
Author_Institution :
NEC Kansai Ltd., Shiga
Abstract :
We have been applying Taguchi Methods to important processes of semiconductor wafer. We review a couple of cases and then show how these methods can help us improve the key processes efficiently.
Keywords :
Taguchi methods; semiconductor device manufacture; wafer level packaging; Taguchi Methods; quality engineering application; semiconductor wafer process; Costs; Data analysis; Etching; Inspection; Mass production; National electric code; Problem-solving; Resistors; Signal processing; Voltage;
Conference_Titel :
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-4-9904138-0-4
DOI :
10.1109/ISSM.2006.4493061
