DocumentCode
3293979
Title
A novel method for determing the lifetime of devices based on process-stress accelerated degradation test
Author
Chunsheng, Guo ; Yunxia, Bai ; Yuezong, Zhang ; Weidong, Ma ; Shiwei, Feng ; Changzhi, Lv ; Zhiguo, Li
Author_Institution
Reliability Lab., Beijng Univ. of Technol., Beijing, China
fYear
2009
fDate
6-10 July 2009
Firstpage
464
Lastpage
467
Abstract
A novel method, which enables rapid determination of lifetime for semiconductor devices, is presented based on progressive-stress accelerated degradation test. Through two steps of acceleration: firstly, using process-stress accelerated test to accelerate the parameter degradation; secondly, using the data of 1~5% degradation to extrapolate the data of 10~50% degradation, this method shortens the test time to dozens or several hundreds of hours. To demonstrate the application of the method, a kind of mature products, Si PNP BJT 3CG120, was tested.
Keywords
bipolar transistors; semiconductor device testing; PNP BJT; Si; process-stress accelerated degradation test; semiconductor devices; Condition monitoring; Degradation; Electronic equipment testing; Life estimation; Life testing; Semiconductor device testing; Semiconductor devices; Stress; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232608
Filename
5232608
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