• DocumentCode
    3293979
  • Title

    A novel method for determing the lifetime of devices based on process-stress accelerated degradation test

  • Author

    Chunsheng, Guo ; Yunxia, Bai ; Yuezong, Zhang ; Weidong, Ma ; Shiwei, Feng ; Changzhi, Lv ; Zhiguo, Li

  • Author_Institution
    Reliability Lab., Beijng Univ. of Technol., Beijing, China
  • fYear
    2009
  • fDate
    6-10 July 2009
  • Firstpage
    464
  • Lastpage
    467
  • Abstract
    A novel method, which enables rapid determination of lifetime for semiconductor devices, is presented based on progressive-stress accelerated degradation test. Through two steps of acceleration: firstly, using process-stress accelerated test to accelerate the parameter degradation; secondly, using the data of 1~5% degradation to extrapolate the data of 10~50% degradation, this method shortens the test time to dozens or several hundreds of hours. To demonstrate the application of the method, a kind of mature products, Si PNP BJT 3CG120, was tested.
  • Keywords
    bipolar transistors; semiconductor device testing; PNP BJT; Si; process-stress accelerated degradation test; semiconductor devices; Condition monitoring; Degradation; Electronic equipment testing; Life estimation; Life testing; Semiconductor device testing; Semiconductor devices; Stress; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
  • Conference_Location
    Suzhou, Jiangsu
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-3911-9
  • Electronic_ISBN
    1946-1542
  • Type

    conf

  • DOI
    10.1109/IPFA.2009.5232608
  • Filename
    5232608